borzwatson
commented
2 years ago I have actioned some of these, if you would be kind enough to take a quick look when you have time please, thank you.
Open ribbotson opened 2 years ago
borzwatson
commented
2 years ago I have actioned some of these, if you would be kind enough to take a quick look when you have time please, thank you.
1) I would change the PAM-42 footprint to have surface mount pads on the top layer rather than though hole. Solder wires down to those pads. 2) The footprint for the SMA connectors do not appear to have the holes for the pins. 3) The power supply looks rather retro with through hole, but if you have them and it works then stick with it. I guess the board is going to pull around 120mA. 4) The layout is rather sparse and could be shrunk to better align the PCB layout to the schematic. 4 layer board will help here as the design can shrink and you have whole layer for 5V power. 5) Matching tiny devices like the RF amplifiers to fat tracks on a 2 layer board is a challenge. I recommend to change to a 4 layer board like JLC7628 with a much smaller top to inner1 layer height to reduce track width. The cost difference of 4 layer is small and the benefit on track width and layout is great. https://cart.jlcpcb.com/impedanceCalculation?_ga=2.207778578.1035166287.1642337558-1291278970.1620660170&_gac=1.175383062.1642519893.EAIaIQobChMIosflsc-79QIVzO7tCh0uUgoeEAAYASAAEgJTDvD_BwE 6) Allow for plenty of stitching of the ground fills. Ground fills i think are best to be solid with no thermal reliefs.