user_project_wrapper fails by default for gf180mcu

[gatecat]

the included lef for user_proj_example is for sky130, so running make harden which happens to build user_project_wrapper first using the old lef results in the following error:

[ERROR]: Last 10 lines:
[WARNING GRT-0036] Pin analog_io[3] is outside die area.
[WARNING GRT-0036] Pin analog_io[4] is outside die area.
[WARNING GRT-0036] Pin analog_io[5] is outside die area.
[WARNING GRT-0036] Pin analog_io[6] is outside die area.
[WARNING GRT-0036] Pin analog_io[7] is outside die area.
[WARNING GRT-0036] Pin analog_io[8] is outside die area.
[WARNING GRT-0036] Pin analog_io[9] is outside die area.
[ERROR GRT-0029] Pin mprj/io_in[0] does not have geometries below the max routing layer (Metal4).
Error: resizer_routing_timing.tcl, 39 GRT-0029
child process exited abnormally

things work fine if you manually build user_proj_example before user_project_wrapper to update the lef.

[vijayank88]

@gatecat Existing flow is default to sky130.

The order of execution is:

1. make user_proj_example
2. make user_project_wrapper

So flow automatically over-write lef/gds/def folder and you won't get such errors.

[jeffdi]

Fixed. See issue #179.