Open bman12three4 opened 1 year ago
The vendor (GF) LEF file for the SRAM covers the entire macro with via1 and via2 obstruction, which is causing issues in magic; I noted last week that there is an issue in the magic code that is preventing me from simply ignoring the via1 and via2 obstruction layers. Instead I reworked the open_pdks makefile to create the SRAM LEF view from scratch, but that update has not been pushed yet. I will try to get that done today.
Trying to insert a "gf180mcu_fd_ip_sram__sram128x8m8wm1" instance into my design causes an error in step 39: Magic Spice Export.
I also had to add
/// sta-blackbox
to the source file in libs.reg in order for it to synthesize.tag: gfmpw-1b pdk: gf180mcuD (gf180mcuC is not in the makefile)