Integrate engraving process of semiconductors in the manufacture impact equations (CPU)

[da-ekchajzer]

Problem

Today, we use impact factors from the publication green cloud computing (We have an english version avaible on demand).

The manufacturing impact is evaluated from the surface of the die of the CPU. The impacts factors are made for a 14nm engraving process.

We should integrate this behavior for other process than 14 nm with other impact factors.

Solution

We know that some work is being conducted for engraving processes below 14 nm. We might be able to integrate those when available.

@ThibaultPirson and his colleagues have made a review of a great amount of impacts factors available for semiconductors impacts for three criteria : water, GWP, primary energy :

• The paper : https://ieeexplore.ieee.org/document/9979766/algorithms#algorithms
• The dataset : https://github.com/ThibaultPirson/environmental-footprint-IC

A first approach could be to implement an optional projection with average values with a high error margin.

@AirLoren I know you are interested in the subject.

[da-ekchajzer]

A new tool was released by IMEC : https://netzero.imec-int.com/. It might be interesting to investigate this. @benjaminlebigot & @csauge I think you have worked on this. If you have some interesting insights you can share, it here.