-Analyze the failure conditions of last year’s backer boards
-Design to fit our new form factor.
-Look into power delivery options through the PCB instead of wired.
-Look into new options of how to mount ESC to boards
-Consider how to make the boards hot-swappable. No soldering or messing around with wires to switch out a board. Avoid having to remove multiple other components to get to boards.
-Consider thermal output of ESCs, see thermal design study from mechanical: -----
-Consider hardware/components already available in EE labs at Mines.
-Analyze the failure conditions of last year’s backer boards
-Design to fit our new form factor. -Look into power delivery options through the PCB instead of wired. -Look into new options of how to mount ESC to boards -Consider how to make the boards hot-swappable. No soldering or messing around with wires to switch out a board. Avoid having to remove multiple other components to get to boards. -Consider thermal output of ESCs, see thermal design study from mechanical: ----- -Consider hardware/components already available in EE labs at Mines.