DLR-SL / CPACS

CPACS - Common Parametric Aircraft Configuration Schema
http://dlr-sl.github.io/CPACS/
Apache License 2.0
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Need of a Thermal Analysis branch in the analyses branch #681

Open flsanche opened 3 years ago

flsanche commented 3 years ago

Within the AGILE 4.0 project's scope, the need for having a thermal analysis branch in the analyses branch of the current CPACS version is required to write the outputs of a tool. Can you add this discipline to the current analyses branch of CPACS?

MarAlder commented 3 years ago

Indeed a thermal analysis branch is very much missing in the analysis node. Can you provide examples of how the XML structure could look like to correspond to your needs?

flsanche commented 3 years ago

Hello, Yes, I have a simple example that I created in the tool-specific branch specifically for my tool. However, the sub-branches would depend on the thermal analysis (CFD, FEM, Nodal network approach, etc.). My tool predicts the thermal risk of the systems. Thus, I copy and paste the considered genericSystem node with its uID and add a node with the thermal risk value. However, It is really specific to my tool.

Capture

For more complex tool and if we think generically, we need to have the possibility to write/use/update different outputs for the aircraft zones (cockpit, cabin, equipment bay, cargo compartment, etc.), some parts of the aircraft fuselage (wing, tail, etc.) et for the systems. Thus, the ideal structure would have the different type of outputs of a thermal analysis tool that can be used by the other disciplines as well:

For example, I would imagine having something like that (imagine indentations before each sub-levels of thermalAnalysis branch): thermalAnalysis temperatures aircraftZones aircraftZone uID cockpit floorTemperature 30.0 heatFluxes fuselageParts fuselagePart uID tail_top_surface radiativeHeatFlux 500.0 thermalRisks genericSystems genericSystem uID HPA riskScore 1.5 heatTransferCoefficients genericSystems genericSystem uID HPA h_convection 10.0

It is not perfect, but it could cover several design problems. You would need to ask other thermal guys to have another feedback on this suggestion.

Regards, Florian