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Radiation hardening in deep space #8

Open NirViaje opened 5 years ago

NirViaje commented 5 years ago

image image

NirViaje commented 5 years ago

@astroprop mentioned GaN power semiconductor, e.g. EPC2001C image image

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Survery

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NirViaje commented 5 years ago

COTS 零件

把双核拆成了两个单核, 分别计算同样的数据。 每个系统配置3块芯片做冗余, 也就是6个核做计算。

据SpaceX前火箭总师John Muratore透露, 龙飞船一共有18个系统, 每个系统配置了3块X86芯片, 龙飞船一共有54块。

猎鹰九号一共有9个分立式发动机, 每个发动机配置了3块X86芯片, 加上主控系统配置了3块, 猎鹰九号一共有30块这样的芯片。

潜在的,神经网络硬件加速的特性有可能对辐射不敏感:

IMPLEMENTATION OF A RADIATION-TOLERANT COMPUTER BASED ON A LEON3 ARCHITECTURE_TurnerD0815.pdf

NirViaje commented 5 years ago
NirViaje commented 5 years ago

TI's guide

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Radiation handbook for electronics: A compendium of radiation effects topics for space, industrial and terrestrial applications

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NirViaje commented 5 years ago

image IRF7NA2907 封装为 SMD-2,IRF7N1405封装为 SMD-1。由于单个 SMD-2 封装的器件外加钽片增加的质量约为 1.19 g,单个 SMD-1 封装的器件外加钽片增加的质量约为 0.96g,所以二次电源增加的总质量约为 11.5g(钽的密度为 16.67g/cm3)