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IHP-GmbH / IHP-Open-PDK

130nm BiCMOS Open Source PDK, dedicated for Analog, Mixed Signal and RF Design
Apache License 2.0
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wirebond-pads and ESD protection #12

Closed olisnr closed 6 months ago

olisnr commented 8 months ago

i would like to know how wirebond-pads and ESD-protection should be done in iHPs and skywaters 130nm BiCMOS processes. is there some documentation? i didnt found anything in the PDKs

olisnr commented 8 months ago

when i open the sg13g2_pr.gds from the PDK, i see many interessting cells. "bondpad" or "diodevdd_2kv" as example. buuuut there is no model for ngspice in the IHP-Open-PDK-main/ihp-sg13g2/libs.tech/ngspice/models and no documentation in the SG13G2_os_process_spec.pdf

HELP!

sergeiandreyev commented 7 months ago

This PDK is in early alpha state. This means the PDK is still in development and not comprehensive tested by IHP. The PDK may contain [serious] errors and may not contain all of the features that are planned for the final version. But we're working constantly on this project to offer as stable PDK as possible to the community.

sergeiandreyev commented 7 months ago

Regarding the bondpad cell I can comment that we do not have a "real" model for it even in the commercial PDK, so please use just a 'placeholder' for this device.