Open sethkaz opened 3 years ago
Is there a global setting for thermal clearance?
15.: widening the plane was not helping to get more thermal spokes. The clearence of the Pads next to it is to large. should I reduce the clearance for that component? Is there an global setting? Or should I leave it then?
15.: widening the plane was not helping to get more thermal spokes. The clearence of the Pads next to it is to large. should I reduce the clearance for that component? Is there an global setting? Or should I leave it then?
To edit them globally, use the button in the lower left of the Copper Zone Properties window.
I was able to get it wrap around and make 3 connections. You just have to play with all 4 numbers a bit.
- The hole size for the LTC4162 is 0.2mm. This might be a challenge to build at some board houses for a reasonable cost.
what hole size would be better?
It really depends on the vendor. PCBway's "cheapest" hole size is 0.3mm.
- The same can be said for the copper of the mounting holes.
Moving them will create a ~big~ mess - I will try it out and see if the manufacturer says anything against it :)
Closed by mistake, sorry
- The same can be said for the copper of the mounting holes.
Moving them will create a ~big~ mess - I will try it out and see if the manufacturer says anything against it :)
Yes, you can try. An alternative is to just reduce the size of the copper without changing the location.
- The connector for J4 is pretty fine in pitch. If the intention is for people to manually solder something in, maybe consider moving up to a 2mm pitch? There is plenty of room to do so.
we will keep it as is - if it makes trouble in practice we might change it. it is a rare feature. With that - I am done with all the topics :)
@Informaticore
I'm not fully agree about the point n°23 : "I would recommend ditching the GND plane on the F.Cu layer completely. It is only being used in 2 places, and both of those can be replaced with a trace very quickly. The disadvantage is that it adds a lot of copper features that could be places that act as antennas or worse."
I think that GND plane shape will act as a shield if linked to the True internal GND Plane via Vias. If there is no lot of free space as on the layer 1 (Top), this is not very usefull, we can keep without it. But I recommend to add it on the layer 4 (Bottom).
Moreover, PCB manufacturers don't like very much when there are a lot of copper to remove by the chemical process.
(It needs to use more "iron perchloride", therefore less ecological)
Need to fix:
Should fix:
Consider fixing:
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