added TSSOP-28 variant with thermal pad

KiCad / Housings_SSOP.pretty

Shrink Small Outline Package footprints

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added TSSOP-28 variant with thermal pad #17

Closed jkriege2 closed 7 years ago

jkriege2 commented 8 years ago

see http://www.ti.com/lit/ds/symlink/tlc5940.pdf
there are still two KLC issues:
1. the 3D model is the same as for the footprint without thermal pad ... so I don't see why I should copy the 3D model
2. I still get the following violation, which I don't understand: "Violating Rule 10.5: Attributes is set to the appropriate value, see tooltip for more information."

htssop28

SchrodingersGat commented 8 years ago

10.5 means that you need to set the "INSERT" attribute for the part. As this is a surface mount part, this attribute needs to be set so that when you generate a .pos file (for a pick-and-place machine), the part gets included in that file.

untitled

jkriege2 commented 8 years ago

Hhmmm ... In the Footprint-Editor that is set ... ??? For the component TSSOP-28_4.4x9.7mm_Pitch0.65mm.kicad_mod which I copied to create the HTSSOP I don't get that error ... I'm a bit confused. Any ideas? Is the script/KiCAD confused as there are SMD and TH pads?

Best, JAN

SchrodingersGat commented 8 years ago

Ah, yep good point. The script is most likely wanting to set the INSERT attribute to both TRUE and FALSE due to the different pad types.

The script should be updated to accommodate this I think!

jkriege2 commented 8 years ago

so, can you merge this, or is something still missing?

SchrodingersGat commented 8 years ago

I would suggest adding a suffix "_ThermalPad" to this part, for easier differentiation.

jkriege2 commented 8 years ago

done!

jkriege2 commented 7 years ago

thanks! :+1: :-)