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KiCad / Housings_SSOP.pretty

Shrink Small Outline Package footprints
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add exposed pad version of TSSOP-20 #18

Closed descampsa closed 7 years ago

descampsa commented 7 years ago

Copied from TSSOP version, pad dimension comes from Allegro A4963 datasheet.

jkriege2 commented 7 years ago

Hi!

thanks for the contribution. There are two things that would be great if you could still change:

  1. Could you give the exposed pad the number 21, so it can be referenced by pins in the symbol?
  2. I think there are usually vias in the EP ... like e.g. in the TSSOP-161EP or the HTSSOP-28..._THermalPad ... could you add them? For that the pad is actually made up of an array of THT pins with only tiny holes and rectangular copper that overlaps so the whole area is filled ...
  3. According to the KLC the Courtyard should be 0.25mm offset from the pads and also from the enclosing silcscreen lines ... so as you're at it: could you move that courtyard a bit farther out to accomodate that? I know it's not (yet) done in the other components ...

Best, JAN

jkriege2 commented 7 years ago

ad 2) again ... thinking about this, maybe it's worthwile to make two versions: One with VIAs and one without (like the one you have, just the PAD renamed) ...

... and one more thing: To remain in the LIB's convention, could you make it ETSSOP with an upper-case E and add a 1EP or _ThermalPad somewhere in the filename?

Thanks, JAN

jkriege2 commented 7 years ago

Thanks for the quick response ... could you also add the 1EP to the file-/footprintname?

Also the 3D model name should be the same as the footprint's name, so could you fix that? If the 3D model does not exist yet, you could simply create it by copying the matching SSOP-20 3D model and rename it accoridngly and add that into a second PR ... I can pull both then ;-)

Best, JAN

descampsa commented 7 years ago

Hey JAN,

Thanks for your comments, i have fixed 1) and 3), and capitalized the name. As for 2), i don't think the vias should belong to the footprints. You don't always put vias on the pads, and you don't always put the same number of vias.

descampsa commented 7 years ago

Ok, i will add the 3D model, then, if it is ok for you like that. Do you prefer that i squash all the commits into one to have a cleaner history?

descampsa commented 7 years ago

Oops, i just noticed that the courtyard were corect, i thought i was in 0,05mm grid when i 'fixed' them, but i was in 0,1mm. According to KLC 6.6, the silcscreen should not be taken into account in the courtyard margin, only pads and body. I agree that silkscreen should be inside courtyard, but this was already the case, so i think courtyard was correct, and i have reverted this change.