Land pattern and outline dimensions are described in Microchip Packaging
Specification (see [1]). QSOP-16 footprint was used as a reference
(which is also relies on [1] for footprint dimensions).
The reason for adding this package is an attempt to add MAX7325AEG+
schematic symbol, which relies on this footprint.
Land pattern and outline dimensions are described in Microchip Packaging Specification (see [1]). QSOP-16 footprint was used as a reference (which is also relies on [1] for footprint dimensions).
The reason for adding this package is an attempt to add MAX7325AEG+ schematic symbol, which relies on this footprint.
[1] http://ww1.microchip.com/downloads/en/PackagingSpec/00000049CH.pdf
Signed-off-by: Sam Protsenko joe.skb7@gmail.com