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KiCad / Housings_SSOP.pretty

Shrink Small Outline Package footprints
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Add TSOP-I footprints #38

Closed evanshultz closed 7 years ago

evanshultz commented 7 years ago

Merging footprints from SMD_Packages as mentioned at https://github.com/KiCad/SMD_Packages.pretty/issues/20.

Datasheets: http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf

Note: There is already a TSOP-I-48 footprint here, but it uses extremely long pads that go under the part body. This is ill-advised since it can allow solder to flow under the part and push it up, preventing proper soldering. Also, the body dimensions on that part are YxX instead of the normal XxY. I'll delete that footprint as part of this PR if requested.

Image: image

evanshultz commented 7 years ago

@jkriege2 And this one? Please read the note above.

jkriege2 commented 7 years ago

Yes, please delete the old one ... also I made a PR to fix the one part that uses that old package (and renames the 3D model): https://github.com/KiCad/kicad-library/pull/1549 please merge that, when I merge this!

Otherwise this looks fine and I would merge it!

JAN

evanshultz commented 7 years ago

@jkriege2 Thanks! Your PR looks good and is merged.

jkriege2 commented 7 years ago

Hi could you please delete the old TSOP-I still in this PR? Then I'll merge. JAN

evanshultz commented 7 years ago

@jkriege2 My mistake. Forgot about that part. Old footprint is now deleted.

jkriege2 commented 7 years ago

Great!

Thanks, JAN