I would like to have two RDMA VFs in a single container and build bond device on top of it. Is it feasible ?
If it is, are there any limitations of current implementation? By limitiations, I mean for example:
1) which bond modes does it support?
2) Can VFs be from only one PF, or from two PFs on single HCA card, or can even be from different HCA card?
Hi,
This is not a issue, but a disscussion.
I would like to have two RDMA VFs in a single container and build bond device on top of it. Is it feasible ?
If it is, are there any limitations of current implementation? By limitiations, I mean for example: 1) which bond modes does it support? 2) Can VFs be from only one PF, or from two PFs on single HCA card, or can even be from different HCA card?
Thanks!