Lets say user wants to slice at 13 microns, but min printer z step is 2 microns. We should support an error accumulation mode where the device slices as close to the user specified thickness as possibly, but accumulates the error, and slices a layer at some point when the accumulated error is exactly sliceable by the printer.
min z is 2 micron
User wants 13 micron layers
We slice at 12, then accumulate the 1 micron error into the next slice. Since the next slice would be 14 which can be evenly divided by 2, we slice that layer slightly thicker at 14 microns.
Lets say user wants to slice at 13 microns, but min printer z step is 2 microns. We should support an error accumulation mode where the device slices as close to the user specified thickness as possibly, but accumulates the error, and slices a layer at some point when the accumulated error is exactly sliceable by the printer.
min z is 2 micron
User wants 13 micron layers
We slice at 12, then accumulate the 1 micron error into the next slice. Since the next slice would be 14 which can be evenly divided by 2, we slice that layer slightly thicker at 14 microns.