Closed charlespax closed 9 years ago
I think there is a good spot for the headers to go. In the Enclosure version 0.1 (SLA) print I cut out the cutout and continued cutting to the wall at the top of that area.
You can see i this image where a connected header cable could sit.
And here is the header seated on the board in that same spot inside the enclosure.
And here is the header on the board without the enclosure back.
I think we would be okay if we moved the thermal isolation slots a bit.
Please advice the location of the connector on the PCB.
From the image I estimated the location of the connector, It seem a little bit difficult to move thermal isolation slots a bit, as the slot and the component at top side around 1mm distance. It is not suggest to place component too close to the slot.
Can we move that component?
Those components are thermocouple circuit, it has little bit space to move inside.
Cool. Please nudge things around, so we can move the slot and get the header in there.
After I fixed the issue - Longer soler pads on 2x3 header footprint #122. The footprint pad size is larger than the component. the header cannot place on the position/orientation suggested by @charlespax.
It sounds like a feature we chose for the test rig is affecting the T400 design in a negative way. Any compromise that needs to be done should happen in the test rig. Rather than using the SIM connector we can figure our something else like individual spring contacts.
@samchoy88 can you place the 2x3 header in the desired location if we went back to the original footprint?
Header position updated in Rev 0.10(unit = mm)
Cool. Closing issue
For history see https://github.com/PaxInstruments/t400-electronics/issues/86.