To increase reliability at high current and to increase thermal performance:
Add extra vias to high-current traces
Add thermal vias where possible
Enlarge & add more filled zones
For cosmetic purposes only:
Make via clusters more uniform
Trace shape conditioning
Label PCB sections on the silkscreen
Edit (New Year's Eve, 2020): two major schematic issues have been fixed as well, and PCB and exported files have been updated to match the latest schematic. v2.3C should now work flawlessly, and software will be finalized after thorough testing and efficiency measurements.
To increase reliability at high current and to increase thermal performance:
For cosmetic purposes only:
Edit (New Year's Eve, 2020): two major schematic issues have been fixed as well, and PCB and exported files have been updated to match the latest schematic. v2.3C should now work flawlessly, and software will be finalized after thorough testing and efficiency measurements.