Xiangyu-Hu / SPHinXsys

SPHinXsys provides C++ APIs for engineering simulation and optimization. It aims at complex systems driven by fluid, structure, multi-body dynamics and beyond. The multi-physics library is based on a unique and unified computational framework by which strong coupling has been achieved for all involved physics.
https://xiangyu-hu.github.io/SPHinXsys/
Apache License 2.0
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Seems heat conductivity never used #581

Closed Xiangyu-Hu closed 5 months ago

Xiangyu-Hu commented 5 months ago

https://github.com/Xiangyu-Hu/SPHinXsys/blob/fa14df82e0d4d99df7e1737072d71a8465f31c51/tests/2d_examples/test_2d_windows_frame_diffusion_D4/windows_frame_diffusion_D4.h#L27-L28

It seems that these two variable are never used.

Xiangyu-Hu commented 5 months ago

@DongWuTUM @Bo-Zhang1995 Could you check with Haotian @Harmon9802 ?

DongWuTUM commented 5 months ago

@DongWuTUM @Bo-Zhang1995 Could you check with Haotian @Harmon9802 ?

I have told Haotian. He will check it.

Harmon9802 commented 5 months ago

@DongWuTUM @Bo-Zhang1995 Could you check with Haotian @Harmon9802 ?

epdm_cond and pane_cond are used for thermal conductivity initialization, and epdm are also used to define the time step as it is the largest conductivity in this case. 1 2

Xiangyu-Hu commented 5 months ago

Understood. The current material model seems lack of mechanism of putting these diffusivities into the diffusive material directly.