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Cover Letter #1

Open bitk20a opened 6 months ago

bitk20a commented 6 months ago

Bao Nguyen Viet YOKOHAMA 235-0035 +818044650392 | baonv1303@gmail.com

RE: Process Integration Engineer

Dear Hiring Manager,

I am writing to express my interest in the Embedded MRAM (eMRAM) Process Integration Engineer position at Samsung Austin Semiconductor. With a solid background in MRAM device physics and extensive experience in MRAM thin film deposition, MRAM device processing, and data analysis, I am confident in my ability to contribute effectively to your team and ensure the successful launch of new eMRAM products.

In my current role as an Integration Engineer at KIOXIA Group, I have spearheaded the establishment of a new MRAM line process, demonstrating my ability to set up and optimize processes for the fabrication of high-performance devices. I have a deep understanding of magnetic tunnel junction (MTJ) stacks, process control, and characterization techniques, which are essential for integrating eMRAM into CMOS flows.

I am proficient in PVD thin film deposition techniques, RIE techniques for MRAM device processing, and characterization tools such as TEM and EDX. Furthermore, my proficiency in Python programming for data analysis and prior experience in process integration make me well-equipped to meet the demands of the role.

Please take a moment to review my attached resume and credentials. I would greatly appreciate the opportunity to speak with you regarding my candidacy.

Thank you for your consideration.

Sincerely, BAO NGUYEN VIET