cogenda
commented
11 years ago Sorry this is not supported. Alternatively, you can enable the "resistive metal" mode in the Global command, i.e. GLOBAL T=300 Resistivemetal=true
In this mode, butting metal regions are allowed. A "solderpad" boundary condition must be defined somewhere on the metal region BOUNDARY id="anode" type="solderpad"
such that you can attach voltage sources to the "anode".
I am trying to butt one electrode against another to form a field plate. The first electrode makes contact with silicon, the second electrode is connected to the first and forms a field plate. There is oxide between the field plate and the underlying silicon. The UG says that this REGION arrangement is OK. It works for making STI however, with Elec, or with Al, it aborts during boundary condition build with no error message.