I found it odd while using Intel's MigTD, that the binary file, which is a td-shim, has gaps in the binary for the TempMem sections. I don't believe there's a need for this, as TDVF metadata should allow for discontiguous firmware memory. Was this an intentional decision?
I found it odd while using Intel's MigTD, that the binary file, which is a td-shim, has gaps in the binary for the TempMem sections. I don't believe there's a need for this, as TDVF metadata should allow for discontiguous firmware memory. Was this an intentional decision?