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danielkucera / cyusb3014-breakout

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BGA pads and vias #3

Open mgiacomelli opened 2 years ago

mgiacomelli commented 2 years ago

I was looking through this design to see how hard a layout would be using the FX3 and I noticed you have the BGA pads touching the vias with no solder mask between them. Did you need to fill the vias with something before reflow? Most of the advice I found online says not to put the vias under BGA balls due to wicking, although I suppose with very small (0.2mm) maybe this is less of an issue.

danielkucera commented 2 years ago

There is solder mask on vias. I didn't do anything special before the reflow.