Closed gustep12 closed 6 years ago
I am defining a new footprint for a molex connector where several pins are either GND or NC.
The multiple GND pins are properly bundled with the -b option.
The multiple NC pins remain unbundled in the resulting KiCad component.
Test-Connector Pin,Name,Type,Side 1,GND,pwr,right 2,GND,pwr,right 3,DAC.1_out,out,right 4,DAC.2_out,out,right 5,DAC.1_10%,out,right 6,DAC.2_10%,out,right 7,NC,nc,right 8,NC,nc,right 9,NC,nc,right 10,NC,nc,right
Ok, I just read that's a feature in the newest revision, not a bug.
Yes, bundling NC pins was leading to ERC errors in EESchema.
I am defining a new footprint for a molex connector where several pins are either GND or NC.
The multiple GND pins are properly bundled with the -b option.
The multiple NC pins remain unbundled in the resulting KiCad component.
Test-Connector Pin,Name,Type,Side 1,GND,pwr,right 2,GND,pwr,right 3,DAC.1_out,out,right 4,DAC.2_out,out,right 5,DAC.1_10%,out,right 6,DAC.2_10%,out,right 7,NC,nc,right 8,NC,nc,right 9,NC,nc,right 10,NC,nc,right