Added scripts, layout, and GDS for building out the bump bond mask data for Micross. Note that this does not include alignment marks; if the information for alignment marks gets provided by GF, then this data set will get updated. Final data to send to Micross is gds/caravel_bump_reticle.gds.gz (probably needs to be uncompressed before sending to Micross). IMPORTANT NOTE: Have not looked at reticle data from GF. Need to confirm direction of rotation of Caravel chips in the slots. Assuming clockwise 90 degrees. Micross wants metal 5 and glass cut data from the GF reticle if we can obtain and prepare it. Should check against the bump bond GDS before sending to Micross.
Added scripts, layout, and GDS for building out the bump bond mask data for Micross. Note that this does not include alignment marks; if the information for alignment marks gets provided by GF, then this data set will get updated. Final data to send to Micross is gds/caravel_bump_reticle.gds.gz (probably needs to be uncompressed before sending to Micross). IMPORTANT NOTE: Have not looked at reticle data from GF. Need to confirm direction of rotation of Caravel chips in the slots. Assuming clockwise 90 degrees. Micross wants metal 5 and glass cut data from the GF reticle if we can obtain and prepare it. Should check against the bump bond GDS before sending to Micross.