The app boards get intermittent pin contact for pins IO_NA_B1 and IO_NA_B2. The boards have been checked to be OK, and the issue occurs across different app boards and board types. The signal measurements on the E1 NA bank connector surface-mount solder joints confirm a good signal. The suspected root cause is at the evaluation board E1 bank connector for Bank NA.
The affected signals on NA_B1 and NA_2 connect to 7-Segment module HEX2, LED segments DP and A.
I would need a second E1 board to fully confirm it. My board may have a faulty NA connector. The E1 evaluation boards BCP thickness of 1.2 mm is rather weak, which lends to bending.
The app boards get intermittent pin contact for pins IO_NA_B1 and IO_NA_B2. The boards have been checked to be OK, and the issue occurs across different app boards and board types. The signal measurements on the E1 NA bank connector surface-mount solder joints confirm a good signal. The suspected root cause is at the evaluation board E1 bank connector for Bank NA.
The affected signals on NA_B1 and NA_2 connect to 7-Segment module HEX2, LED segments DP and A.
I would need a second E1 board to fully confirm it. My board may have a faulty NA connector. The E1 evaluation boards BCP thickness of 1.2 mm is rather weak, which lends to bending.