Open davidedelvento opened 1 week ago
(2) - agree, a better solution is needed. The ACE boards help a little but not sufficiently.
(4), (5) - this would be interesting and very flexible... I will think about it. Maybe it is called IPS 3.0 too. Saves at least 1.5 inches of width. Note that with present board, future SCA design variations can optionally fill the entire TFT PCB space. I designed it this way after considering the mm^2 required for 6 parallel ADC on a new data acq card. So that is why I was ok with the quarter inch jack real estate.
However, taking the modular concept one step further, I could in theory put each function on its own board. 1 board for 96 analog inputs 1 board for data acq 1 board for processing 1 board for display and switches 1 board for pedals 1 board for data i/o 1 board for display Connect them together with Ethernet cables (as you noted). Then, everything is highly modular, incredibly flexible/expandable, and minimally small.
Note that with present board, future SCA design variations can optionally fill the entire TFT PCB space. I designed it this way after considering the mm^2 required for 6 parallel ADC on a new data acq card. So that is why I was ok with the quarter inch jack real estate.
Would this be to reduce latency / scanning time? If so, rather than having larger SCA and IPS (which are expensive to make) why not have multiple boards like you currently have for hammer and damper sensors? Most PCB houses have a minimum order of 5 boards anyway, so having more boards smaller rather than one board larger makes financial sense (and ease the logistics of cabling since each board could be attached only on (say) an octave or two. Of course a communication protocol better/faster than the CAN bus might be needed.
To avoid making issue #52 a giant discussion, let me discuss here some things which I think you could/should do for the next version