Main changes:
-Brought the HE0 GND to front so the heat is not on the backside.
-Modified HE0 GND from 1.4mm to 1.5mm like the V24
-Changed some route to minimize use of via holes.
Cosmetic:
-Changed for 4.1
-Added pin label for the estep on the BottomLayer
Main changes: -Brought the HE0 GND to front so the heat is not on the backside. -Modified HE0 GND from 1.4mm to 1.5mm like the V24 -Changed some route to minimize use of via holes.
Cosmetic: -Changed for 4.1 -Added pin label for the estep on the BottomLayer
Kept same pin location to maintain compatibility.