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komalkaurr / Group_3_Winter-2021

EMBT Term 4 ESE_4009_2_Embedded Systems Engineering Project Group_3
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PCB Implementation #13

Closed mikeshams closed 3 years ago

mikeshams commented 3 years ago

What issue did you face and how to resolve them?

virender435 commented 3 years ago

Issues I faced during Soldering:- As I was new to the Soldering Part so it was bit challenging for me to do this part but with the help of my friends I was able to do it. Challenges and Issues faced:- 1: There were lot of components to be soldered as there were too many wire connections to be made. So it was bit difficult and challenging part. 2: Too much solder when soldering and large bubble like solder ball forms at solder joints. 3: The joint has a burnt appearance and if the pads have lifted at the joints, the PCB might be damaged beyond repair. 4: Insufficient Wetting as joints were not fully wetted and were weak and they do not form a strong connection with the board.