Closed leomcelroy closed 1 year ago
Right now vias are added as components but they have some unique qualities such as thru-hole plating and not being in the solder mask.
Actually think it's more desirable to be able to do vias as footprints. New method for describing holes will better support this.
Right now vias are added as components but they have some unique qualities such as thru-hole plating and not being in the solder mask.