jpj79
commented
13 years ago Implementation Error: ERROR:Pack:2309 - Too many bonded comps of type "IOB" found to fit this device. ERROR:Map:237 - The design is too large to fit the device. Please check the Design Summary section to see which resource requirement for your design exceeds the resources available in the device. Note that the number of slices reported may not be reflected accurately as their packing might not have been completed. NOTE: An NCD file will still be generated to allow you to examine the mapped design. This file is intended for evaluation use only, and will not process successfully through PAR. LIT:243 - Logical network sub_overflow has no load. LIT:395 - The above info message is repeated 6 more times for the following (max. 5 shown): mult_overflow, L_mult_overflow, add_overflow, L_mac_overflow, L_add_overflow To see the details of these info messages, please use the -detail switch. MapLib:562 - No environment variables are currently set. LIT:244 - All of the single ended outputs in this design are using slew rate limited output drivers. The delay on speed critical single ended outputs can be dramatically reduced by designating them as fast outputs. Pack:1716 - Initializing temperature to 85.000 Celsius. (default - Range: 0.000 to 85.000 Celsius) Pack:1720 - Initializing voltage to 0.950 Volts. (default - Range: 0.950 to 1.050 Volts)
Need to look into a file to instantiate the port list in Levinson_Durbin_FSM.v.
wolftrax84
Test Levinson-Durbin. Test this one 3rd.