Closed ForrestErickson closed 5 months ago
select the copper fill and edit its properties, change the pad connection from ' Relief to PTH' to 'Thermal Relief', Click 'OK' then press 'B' to repour the copper fill. Delete redundant ground traces.
Results.
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There is inadequate thermal releafe on the SMD and PTH pads on the PCB
Describe the solution you'd like A clear and concise description of what you want to happen. Set the fill properties appropriately for thermal relief.
Describe alternatives you've considered A clear and concise description of any alternative solutions or features you've considered.
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