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opencomputeproject / ODSA-BoW

Repo for all activity related to the ODSA Bunch of Wires Specification
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Redundancy in the bump pattern #18

Open bapivee opened 4 years ago

bapivee commented 4 years ago

https://github.com/opencomputeproject/ODSA-BoW/blob/009cd9eda3e79b7c0bf5f1e7520417e303ed1640/spec/bow_specification/bow_specification.mdk#L452

Should the spec support redundant bumps

kenpoulton commented 4 years ago

Both AIB and HBM2 include redundancy, though I see 13,600 bumps for an HBM2 assembly.

How many wires do we want BoW to extend to? 100? 1000? 10,000? Does anyone have any yield data on 130-um laminate packages?