Open bapivee opened 4 years ago
S-parameter channel models for candidate packaging solutions, create loss curves, verify the loss curves are meaningful. Crosstalk - function of number of pins and what the bump map looks like. Channel integrity spec.
Other specs create multiple reference channel models since we don't have a single implementation. May need a lot of detailed assumptions to create S-parameters. Need to get input from packaging experts. Choose standard bump pitches?
Goal of the channel model is to allow interoperability between vendors that meet the electrical specifications. Minimum requirements on channel to specify frequency range on which interoperation is expected.
Should this be merged with https://github.com/opencomputeproject/ODSA-BoW/issues/37 ?
https://github.com/opencomputeproject/ODSA-BoW/blob/009cd9eda3e79b7c0bf5f1e7520417e303ed1640/spec/bow_specification/bow_specification.mdk#L382
Add information on the eye diagram, ratify channel model