We can make a single spec for both laminates and interposer and may not be optimized for either. Assumption is a system is captive for one type of packaging. So having a PHY not optimized for either may not be useful.
If HBM3 is a leading indicator and moving away from silicon interconnect, then we consider dropping
interposer as an objective.
We can make a single spec for both laminates and interposer and may not be optimized for either. Assumption is a system is captive for one type of packaging. So having a PHY not optimized for either may not be useful.
If HBM3 is a leading indicator and moving away from silicon interconnect, then we consider dropping interposer as an objective.