Closed TenilleJohnson closed 7 years ago
Description: An instrument that is used to bind two wafers together, typically by means of temporary bonding using a bonding agent or by permanent bonding of the oxide film surfaces using a self-bonding technique. Superclass: instrument
Requested by: eaglei@mail.med.upenn.edu
Description: An instrument that is used to bind two wafers together, typically by means of temporary bonding using a bonding agent or by permanent bonding of the oxide film surfaces using a self-bonding technique. Superclass: instrument
Requested by: eaglei@mail.med.upenn.edu