IMPLEMENTED
What: Replaced STM32F031K6Ux with STM32F030K6Tx
Why:
Most popular chip in F0 series, hence easier to source and harder to be on shortage
Being a LQFP package improves inspection, debug and hand soldering, Also pin pitch is slightly wider.
Change 2
BEING IMPLEMENTED
What: Remove STM32F031C6Tx
Why:
Supporting two MCUs will require doubling the tests on every component change.
Having two MCU footprints has minimal impact in shortage immunity (specially from the same manufacturer) since two is still very limited number of alternatives comparing to the number of different chips available.
Not so popular chip and currently not very well stocked.
I am withdrawing this PR since at this point in development it is not viable to include this changes and being this a band aid. Let's address this later in another form :)
Change 1
IMPLEMENTED What: Replaced STM32F031K6Ux with STM32F030K6Tx Why:
Change 2
BEING IMPLEMENTED What: Remove STM32F031C6Tx Why:
TODO: