Open dan-gies opened 6 months ago
REV05
Bugfix
The thermal pads on the motor driver ICs have thermal reliefs on their thermal pads on the top and bottom layers. This impedes thermal dissipation.
To get the best thermal transfer possible, this thermal pad must be direct-connected to the GND copper pours. Otherwise, the part risks overheating.
Version Number
REV05
Bugfix or Enhancement
Bugfix
Description
The thermal pads on the motor driver ICs have thermal reliefs on their thermal pads on the top and bottom layers. This impedes thermal dissipation.
Suggested Solution
To get the best thermal transfer possible, this thermal pad must be direct-connected to the GND copper pours. Otherwise, the part risks overheating.