Closed zsup closed 10 years ago
We should ensure that solder doesn't seep through the board between the USB connector and the LDO. Likely solution is to simply remove the vias entirely, as the USB through-hole pins should provide the necessary heatsinking.
We should ensure that solder doesn't seep through the board between the USB connector and the LDO. Likely solution is to simply remove the vias entirely, as the USB through-hole pins should provide the necessary heatsinking.