add updated script from MSOP10

[lukh]

Providing HVSSOP yaml settings for https://github.com/KiCad/kicad-symbols/pull/2717

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[cpresser]

Related: https://github.com/KiCad/kicad-footprints/pull/2460

Datasheet: https://www.ti.com/lit/ds/symlink/bq24090.pdf

[lukh]

Hi, thank for the help; a general remark based on yours, The work here is mainly based on the MSOP-10 package, regarding this " Very Thin Shrink Small Outline Package, also referred as MSOP = Micro Small Outline Package " (https://www.ti.com/support-packaging/packaging-resources/packaging-terminology.html)

And the fact that the component designed (https://github.com/KiCad/kicad-symbols/pull/2717), in its first revision, was using the MSOP-10 package, with sucess.

I work on the specific points now ! Bests,

[cpresser]

Hi, sorry for all the fuzz, I guess from your point of view that is pretty ridiculous.

The work here is mainly based on the MSOP-10 package, regarding this " Very Thin Shrink Small Outline Package, also referred as MSOP = Micro Small Outline Package " (https://www.ti.com/support-packaging/packaging-resources/packaging-terminology.html)

And the fact that the component designed (KiCad/kicad-symbols#2717), in its first revision, was using the MSOP-10 package, with sucess.

There are two reasons why I am picky here:

1. Consistency. People looking at this in the future should not ask themselves why some dimensions differ from the datasheet. Also, why make a new footprint if its the same as the existing one?
2. We want footprints to be as good as possible - to maximize yield in automated production lines.

Anyway, I like you changes. There is just one thing I still don't understand. Why the line

grid: [1.1, 1.3]

What does it do?

[lukh]

Hi, No problems at all ! It is a good thing :+1:

Ok the grid apply a coefficient to dimensions of the back pad of EP. I remove it.

[cpresser]

Looks good. Thanks!