Moving SMD's to new board THEN running data recovery?

[GoogleCodeExporter]

What steps will reproduce the problem?
1. Soak in water
2. Immediately plug phone into wall
3. Hear a unsettling sizzling noise

What is the expected output? What do you see instead?

Absolutly nothing

What version of the product are you using? On what operating system?
 3gs - 4
iOS 4+

Please provide any additional information below.

Theoretically would i be able to switch the NAND and the Application Processor 
and be able to pull a decrypted image. From what i understand the only thing 
needed other then the NAND of course is the UID which is stored on the 
application processor (right?). I have been practicing removing bga's and i 
think i might be able to do it, i would just like to know what other people 
think before i go ahead and ruin a bunch of 3gs boards.

Thanks 

Original issue reported on code.google.com by rgerst...@hotmail.com on 22 Feb 2012 at 6:43

[GoogleCodeExporter]

The UID key is unique for each application processor so you cannot move the 
NAND to a different board to decrypt data. Can you put the water-damaged device 
into DFU mode ?

Original comment by jean.sig...@gmail.com on 22 Feb 2012 at 7:28

[GoogleCodeExporter]

Yes, but if i moved the application processor as well? I was under the 
impression that the UID was stored in the application processor. If not would 
you know what chip the UID is stored on? This actually hasn't happened to me, I 
know better then to power it on after water damage :) but for the question no, 
the iPhone doesn't get power.

Original comment by MARYGERS...@gmail.com on 22 Feb 2012 at 7:39

[GoogleCodeExporter]

yes the UID key should be in the application processor. Good luck !

Original comment by jean.sig...@gmail.com on 23 Feb 2012 at 9:24

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Cool Thanks, Will let you know how it goes!

Original comment by rgerst...@hotmail.com on 1 Mar 2012 at 2:08

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Just wanted to let you guys know that I wasn't able to pull the chips off the 
board. Went through about 3 3GS boards, the problem is apple puts a bunch of 
adhesive on there BGA chips. The temperature that this adhesive gives away at 
boils your board. You can chip the stuff away on the sides but you can't get it 
between the solder points. There is stuff you can buy that will dissolve the 
adhesive but I didn't really want to mess with chemicals. So if you want to try 
this you will have to find some way of getting the adhesive off first.   

Original comment by rgerst...@hotmail.com on 4 Oct 2012 at 4:18

[GoogleCodeExporter]

Original comment by jean.sig...@gmail.com on 26 Jan 2013 at 10:58

• Changed state: Done