I see from the graph on the main page that 4 modules are assembled, but from the talks today it sounds like only 1 has really been assembled. Based on the assembly status page, I am guessing that modules are counted as assembled after the HDI is attached, regardless of whether the wire bonding, etc. has been performed. Is this really what we want? I would think post-encapsulation would be better
I see from the graph on the main page that 4 modules are assembled, but from the talks today it sounds like only 1 has really been assembled. Based on the assembly status page, I am guessing that modules are counted as assembled after the HDI is attached, regardless of whether the wire bonding, etc. has been performed. Is this really what we want? I would think post-encapsulation would be better