Closed merkelp closed 9 years ago
Hi, the following modules are missing the information about which flip chip machine was used for the process:
P-A-3-42 P-A-2-08 P-A-3-43 P-A-3-34 P-A-2-04 P-A-2-42 P-A-3-36
It would be good if the assembly sites could add this information.
I've updated all of the modules. They were all processed on the Datacon bonder.
Hi, the following modules are missing the information about which flip chip machine was used for the process:
P-A-3-42 P-A-2-08 P-A-3-43 P-A-3-34 P-A-2-04 P-A-2-42 P-A-3-36
It would be good if the assembly sites could add this information.