When making a layout with a lot of devices, the pads end up awfully close together:
This wasn't an issue in previous layouts because they were sparser and the pads in adjacent cells ended up being offset from each other in the x-direction. When the x-locations are the same, though, there is simply not enough room. When wirebonding a layout like this there's a high risk of accidentally shorting an adjacent device's pads. It's probably fine, but it would stress me out.
I think there should be a Design-level option for building in padding between dies, not only for the edges of the chip.
When making a layout with a lot of devices, the pads end up awfully close together:
This wasn't an issue in previous layouts because they were sparser and the pads in adjacent cells ended up being offset from each other in the x-direction. When the x-locations are the same, though, there is simply not enough room. When wirebonding a layout like this there's a high risk of accidentally shorting an adjacent device's pads. It's probably fine, but it would stress me out.
I think there should be a Design-level option for building in padding between dies, not only for the edges of the chip.