Closed rusefillc closed 2 years ago
Same question for "SOIC" TLS115
vaguely related to https://github.com/andreika-git/hellen-one/issues/167
I'd say prioritize heat management over ease of soldering, I did find a much better soldering guy locally that will take care of this when needed. He repairs phones/laptops and has experience in BGA reflowing and such
we have a clear pattern where thermal pads are asking for above average soldering skills - ETB chip on all boards, PT2001 on GDI4 etc
can we add one or two 1mm via under Q7 and frends since those are now NOT JLC assembled as before?