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sinara-hw / Phaser

Quad channel 1GS/s RF generator card with dual IQ upconverter and dual 5MS/s ADC and FPGA in EEM form factor
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Solder Mask and reflow reliability #117

Closed jordens closed 3 years ago

jordens commented 3 years ago

There are about a dozen instances where gaps between pads don't have solder mask or where components are really close together. Especially the decaps under the dac and the inductors (L31 etc) at the upconverters baseband inputs. The parts float around and move during reflow. Under the dac they merge and rotate because there is unmasked copper between parts. The inductors tip over and lean against each other (their placement is probably also bad in terms of coupling). If this isn't clear from the description I'll take a photo. Let's fix that.

gkasprow commented 3 years ago

OK, I know which ones you mean. we need to slightly separate the capacitors obraz

jordens commented 3 years ago

Yes. The tilting of the (blue) inductors (L31, L29, L33, L38) at the upconverter BB inputs can also be seen in your photo. The pads look really small.

gkasprow commented 3 years ago

fixed obraz

gkasprow commented 3 years ago

I changed the rule to 0.15mm instead of 75um

jordens commented 3 years ago

Also the mixer inductors? image

gkasprow commented 3 years ago

I separated them and increased the pad size