Closed marmeladapk closed 5 years ago
There are 4 vias that are exposed and probably shouldn't be (on DP0_C2M_P _N, FMC1_G3TCLK0_M2C_P _N).
All thermal vias under thermal pads should have solder mask tenting disabled.
There are 4 vias that are exposed and probably shouldn't be (on DP0_C2M_P _N, FMC1_G3TCLK0_M2C_P _N).
All thermal vias under thermal pads should have solder mask tenting disabled.