Rework the footprint and/or routing for X2. I had to replace about a third of these oscillators in build 7. It wasn't because they were poorly soldered. Many of the metal caps just fell off when a little bit of heat was applied. This didn't happen with the replacement parts. I found it difficult to solder X2 because the ground pin 2 was hard to heat. The pad sizes and thermal transfer to ground need to be reduced. They may have had problems in China with this which led to the many failures.
Rework the footprint and/or routing for X2. I had to replace about a third of these oscillators in build 7. It wasn't because they were poorly soldered. Many of the metal caps just fell off when a little bit of heat was applied. This didn't happen with the replacement parts. I found it difficult to solder X2 because the ground pin 2 was hard to heat. The pad sizes and thermal transfer to ground need to be reduced. They may have had problems in China with this which led to the many failures.