All of the ACIS thermal models include some thermal contribution from ACIS electronics that depends on: number of chips, FEPs, are we clocking or not, are the video boards powered or not.
The name for this class is AcisDpaStatePower, which is a bit misleading when applied to the models besides the one for the DPA. This caused a bit of trouble the other day when I was trying to interpret the modeled state power in the DEA model and was thinking about the power from the DPA (my fault, of course).
I would suggest renaming it to AcisStatePower, but that would necessitate re-naming the class name in the JSON files as well.
All of the ACIS thermal models include some thermal contribution from ACIS electronics that depends on: number of chips, FEPs, are we clocking or not, are the video boards powered or not.
The name for this class is
AcisDpaStatePower, which is a bit misleading when applied to the models besides the one for the DPA. This caused a bit of trouble the other day when I was trying to interpret the modeled state power in the DEA model and was thinking about the power from the DPA (my fault, of course).I would suggest renaming it to
AcisStatePower, but that would necessitate re-naming the class name in the JSON files as well.