Closed worldwidemv closed 5 years ago
Unfortunately, that product is a little old and the original engineer has moved on to another company.
I am not absolutely sure, but we may have missed that information in the Design Guidelines. It looks like that information cites package stress relief for omitting the EP. That being said, I don't think we have had many production issues with that board and the MPU-9250 is now EOL, so it is probably too late to make any changes now.
Hello,
first all nice board. I think this is the smallest one I have seen so far. Anyway, I have a question about the exposed pad of the MPU9250.
You soldered it to GND. I know the Datasheet has no information what so ever about the pad, but according to https://store.invensense.com/datasheets/invensense/Accelerometer_Gyroscope_Design_Guidelines.pdf page 9 it should not be solder.
Maybe you have some more information from Invensense. I would love to hear what you think.
Sincerely Markus