Closed lewispg228 closed 9 years ago
1) fixed 2) Added note 3) replaced parts with proper IDed parts 4) Reverted back to original center pad design and cream from HTU21D, which reflowed fine with both ICs.
4) I'm not sure why the tStop looks this way... It's actually smaller than the tCream. Is this what you intended?
TSTOP embiggened, please review.
Looks good. thanks!
Hey Joel, sorry this review was delayed a couple days. Blame Halloween. Your layout looks good. Just a few little things.
1) Is the version number correct? [NO] comment: Should be v01 for proto - don't forget to fix in copper too.
2) Are any appropriate warnings (voltage conversion, sensitive I/O) labeled? [NO] comment: Are the SDA and SCL lines 5V tolerant? Either way, it'd be nice to add a note in the schematic
3) Does every part have a PROD_ID? [NO] comment: R1 R2 and C1 all need to be switched out for devices with prod ids
4) Are bottom side center ground pads 50 percent pasted? [NO] comment: Current paste is 100 percent coverage. Data sheed page 32: "A 2x1 array of 1.00 mm square openings on 1.30 mm pitch should be used for the center ground pad to achieve a target solder coverage of 50%."